| Manufacturer's Description |
The Thermocarbon ESEC 8003 is a high performance, multi-processor,
fully programmable, precision wafer dicing saw. Based on dependable & accurate
swiss mechanical features including:
-Precision control in Index, Rotation, & Stroke
-Powerful Teach Mode for fast programming & set-ups
-Advanced color camera & display system for precision measurements
-All cut parameters continuously displayed during cut
-Up to 100 stored programs
-Up to 12 steps per program
-Multi-axis measurement modes
-Automatic wear compensation
-Multi-depth cutting
-All features completely programmable
-continuous memory for all operating parameters & programs
Although this saw is extremely flexible & can be programmed to cut an unlimited
variety of patterns, it is exceptionally easy to use and can be used in a production
cutting environment.
The programming system allows you to set up cutting patterns of almost
unlimited complexity with ease. Both index & rotation can be taught
to the system. Dynamic compensation allows the user to correct for cumulative
sub-micron drift in the materials being cut.
Advanced interlocks & features make the saw both easy & safe to use.
These features include: auto vacuum, air pressure, over-temp,
& vacuum loss detection, lighted emergency stop for low light operation,
& extensive logic checks in the ROM based embedded
software system.
|
| Specifications |
Wafer Thickness: 10-5000 microns
Wafer Size: 25.4-152.4 mm
Dice Blade RPM: 15,000 to 45,000 RPM
Rotation Angle: 0.01 to 165 degrees
Index step: 20-99,999 microns
Feed Rate: 0.5 to 239 mm/sec
Flanges: 49mm & 51 mm
Voltage: 208-240 VAC +/-10 percent, 50/60 Hz max.
Air Pressure (air free of moisture and oil) 4.5 to 6 bar (64 to 85 psi)
Water Pressure: Up to 6 bar
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